? semiconductor components industries, llc, 2002 may, 2002 rev. 7 publication order number: bat54t1/d 1 bat54t1 preferred device schottky barrier diodes these schottky barrier diodes are designed for high speed switching applications, circuit protection, and voltage clamping. extremely low forward voltage reduces conduction loss. miniature surface mount package is excellent for hand held and portable applications where space is limited. ? extremely fast switching speed ? low forward voltage 0.35 volts (typ) @ i f = 10 madc maximum ratings (t j = 125 c unless otherwise noted) rating symbol value unit reverse voltage v r 30 volts forward power dissipation, fr5 board (note 1) @ t a = 25 c derate above 25 c p f 400 3.2 mw mw/ c thermal resistance, junction to case r jl 174 c/w thermal resistance, junction to ambient r ja 492 c/w forward current (dc) i f 200 max ma nonrepetitive peak forward current t p < 10 msec i fsm 600 ma repetitive peak forward current pulse wave = 1 sec, duty cycle = 66% i frm 300 ma junction temperature t j 125 max c storage temperature range t stg 55 to +150 c 1. fr-5 = 1.0 x 0.75 x 0.062 in. 1 cathode 2 anode 30 volt schottky barrier detector and switching diodes device package shipping ordering information bat54t1 sod123 3000/tape & reel sod123 case 425 style 1 2 1 preferred devices are recommended choices for future use and best overall value. aa aa aa 12 marking diagram sb http://onsemi.com
bat54t1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 a) v (br)r 30 volts total capacitance (v r = 1.0 v, f = 1.0 mhz) c t 7.6 10 pf reverse leakage (v r = 25 v) i r 0.5 2.0 adc forward voltage (i f = 0.1 madc) v f 0.22 0.24 vdc forward voltage (i f = 30 madc) v f 0.41 0.5 vdc forward voltage (i f = 100 madc) v f 0.52 0.8 vdc reverse recovery time (i f = i r = 10 madc, i r(rec) = 1.0 madc, figure 1) t rr 5.0 ns forward voltage (i f = 1.0 madc) v f 0.29 0.32 vdc forward voltage (i f = 10 madc) v f 0.35 0.40 vdc forward current (dc) i f 200 madc repetitive peak forward current i frm 300 madc nonrepetitive peak forward current (t < 1.0 s) i fsm 600 madc
bat54t1 http://onsemi.com 3 c t , total capacitance (pf) notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2 k 820 0.1 f dut v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1 ma output pulse (i f = i r = 10 ma; measured at i r(rec) = 1 ma) i f input signal figure 1. recovery time equivalent test circuit 100 0.0 0.1 v f , forward voltage (volts) 0.2 0.3 0.4 0.5 10 1.0 0.1 85 c 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 510 15 20 25 0 v r , reverse voltage (volts) 51015 30 figure 2. forward voltage figure 3. leakage current figure 4. total capacitance 40 c 25 c t a = 150 c t a = 125 c t a = 85 c t a = 25 c 0.6 55 c 150 c 125 c 100 1000 30 25 20 i r , reverse current ( a) i f , forward current (ma) 14 12 10 8 6 4 2 0
bat54t1 http://onsemi.com 4 the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 225 milliwatts. information for using the sod123 surface mount package minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. sod123 power dissipation p d = t j(max) t a r ja p d = 150 c 25 c 556 c/w = 225 milliwatts the power dissipation of the sod123 is a function of the pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipa- tion. power dissipation for a surface mount device is deter- mined by t j(max) , the maximum rated junction temperature of the die, r ja , the thermal resistance from the device junction to ambient, and the operating temperature, t a . using the values provided on the data sheet for the sod123 package, p d can be calculated as follows: the 556 c/w for the sod123 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milli- watts. there are other alternatives to achieving higher power dissipation from the sod123 package. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. there- fore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling. * soldering a device without preheating can cause exces- sive thermal shock and stress which can result in damage to the device. sod123 mm inches 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165
bat54t1 http://onsemi.com 5 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. cathode 2. anode aaaa aaaa b d k a c e j 1 2 h dim min max min max millimeters inches a 0.055 0.071 1.40 1.80 b 0.100 0.112 2.55 2.85 c 0.037 0.053 0.95 1.35 d 0.020 0.028 0.50 0.70 e 0.01 --- 0.25 --- h 0.000 0.004 0.00 0.10 j --- 0.006 --- 0.15 k 0.140 0.152 3.55 3.85 (sc70) sod123 plastic package case 42504 issue c
bat54t1 http://onsemi.com 6 notes
bat54t1 http://onsemi.com 7 notes
bat54t1 http://onsemi.com 8 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and re asonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employ er. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. bat54t1/d thermal clad is a trademark of the bergquist company. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada
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